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Lamination

Making Circuit Boards Step 7

Bonding

  • The Lamination process is a temperature and pressure method, typically performed under vacuum.
  • During lamination the resin in the bond material liquefies and then cures back to a solid state creating a homogenous package. 
  • Although different bonding and laminate materials may be interchanged, the best results are usually found when using common dielectrics that are compatible.